A.L.S.I.  Terms of Use

Terms of Use

PLEASE READ THESE TERMS CAREFULLY BEFORE USING THIS WEB SITE

Advanced Laser Separation International N.V. is a corporation established under the laws of the Netherlands, having its registered seat in Beuningen, the Netherlands, hereinafter referred to as "ALSI".

The following terms constitute a legal agreement between you and ALSI. By accessing, browsing and/or using this web site (the “Site”) or downloading any materials from this Site, you acknowledge that you have read, understood and agree to be bound by, these terms and to comply with all applicable laws and regulations. If you do not agree to these terms, do not use this Site or download any materials from it.

The materials on this Site are provided by ALSI as a service and may be used for informational purposes only. Single copies may be downloaded subject to the provisions below.

The materials on this Site regarding or relating to ALSI and its products, services, suppliers and contractors, are provided "as is" without any express or implied warranty of any kind, such as merchantability, non infringement of intellectual property or fitness for any particular purpose.

In no event shall ALSI or any of its suppliers or contractors be liable for any (consequential) damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of this site, or any information, statements and comments contained within, even if ALSI has been informed of the possibility of certain damages. In addition, ALSI does not warrant the completeness or accuracy of the information, data, text, graphics, links or other items contained within these materials. These or other limitations of liability do not apply if prohibited by law.

ALSI may make changes to these materials, or to the products described therein, at any time without notice. ALSI also makes no commitment to update the materials.

Linked sites are not under the control of ALSI and ALSI is not responsible for the content of any linked site or any linked site or link contained in a linked site. ALSI reserves the right to terminate any link or linking program at any time.

ALSI does not endorse companies or products to which it links, and reserves the right to note such on its web pages. If you decide to access any of the third party sites linked to this Site, you do this entirely at your own risk.

Nothing in this publication is intended to make representations with regard to whether any trademark is registered or to suggest that any sign other than those mentioned should not be considered to be a trademark of ALSI or of any third party.

These terms and conditions are governed by, construed and enforced in accordance with the laws of the Netherlands. Disputes arising here from are exclusively subject to the jurisdiction of the District Court of 's-Hertogenbosch.

News

24 Aug 2010

ALSI @ Semicon in Taiwan on 8-10 Sept 2010

Come and visit us @ booth # 826 and discuss our new developments on Low-K, IC, Thin Wafer and LEDmore


05 Aug 2010

Succesful introduction of new ICA 1204 at Semicon West

more


31 Jul 2010

ALSI new high speed 300 mm low k grooving and dicing systems to American and Asian customers.

After an intensive development effort and close cooperation with a number of strategic customers, ALSI is shipping the first systems of their new ICA 1204 platform. The platform is for up to 300 mm wafers with full integration of various pre-and post laser processes. The platform is equipped on the unique planar motor system which has proven its superior performance and is based on ALSI’s multibeam laser concept for fast and high quality dicing and grooving process.more


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