Technology

Designed for your needs

The demanding semiconductor market and its consistent pursuit for smaller, better and more cost effective products enforce increasing demands on the production methods, including wafer dicing. Laser dicing is recognized as the dicing technology of the future as it supports the requirements from the market. Even more, laser dicing plays a crucial instrumental role in the maturity growth of latest technological breakthroughs. ALSI holds and extends its leading role based on a strong technology foundation:

• Patented Multi Laser Beam Technology
• Dedicated machine platform, optimized for productive laser dicing