News
24 Aug 2010
ALSI @ Semicon in Taiwan on 8-10 Sept 2010
Come and visit us @ booth # 826 and discuss our new developments on
Low-K, IC, Thin Wafer and LEDmore
05 Aug 2010
Succesful introduction of new ICA 1204 at Semicon West
more
31 Jul 2010
ALSI new high speed 300 mm low k grooving and dicing systems to American and Asian customers.
After an intensive development effort and close cooperation with a number
of strategic customers, ALSI is shipping the first systems of their new
ICA 1204 platform. The platform is for up to 300 mm wafers with full integration
of various pre-and post laser processes. The platform is equipped on the
unique planar motor system which has proven its superior performance and
is based on ALSI’s multibeam laser concept for fast and high quality dicing
and grooving process.more
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