A.L.S.I.  Products

Products

Committed to your expectations

ALSI is committed to deliver products that will surpass the customer’s expectations. The products excel in uptime and performance, delivering a sustainable cost of ownership advantage.

ALSI offers laser dicing systems that, depending on process time and required flexibility, are ideally suited for your application and enable the lowest cost of ownership:

  • DCM 802 (Semi automatic system):  applications where dicing time is relative long or systems are not used in a 24/7 production. Also applications when a variety of wafer diameters or structures need to be processed. These systems are field upgradeable to fully automatic systems.
  • DCA 802 (Automatic system):  applications where dicing time is relatively short or systems are used in a 24/7 production environment. Also applications where operators are needed to operate multiple systems simultaneously.
  • ICA 1204 (Integrated system):  applications where in-line coating and cleaning is required, where die strength recovery is necessary, and where maximum productivity is desired.

State of the art and dedicated semi conductor equipment manufacturers

Quality standards

Factory quality standards comply with ISO 9001: 2000 and 14001 standards. The factory has many years of experience in building semiconductor equipment and can comply with any other high level of custom standards if needed.


Factory overview

The supply chain of our system is organized to safeguard the Customer Satisfaction as best as possible. The system is built according to released technical documentation and customized in line with process and application development results. An extensive factory acceptance test (FAT) is organized based on documented procedures and checklists, followed by a site acceptance test (SAT). Shipment is directly from the factory to the customer.

Our manufacturing is located in the eastern part of the Netherlands, approx 1 hour drive from our development and support location.

News

24 Aug 2010

ALSI @ Semicon in Taiwan on 8-10 Sept 2010

Come and visit us @ booth # 826 and discuss our new developments on Low-K, IC, Thin Wafer and LEDmore


05 Aug 2010

Succesful introduction of new ICA 1204 at Semicon West

more


31 Jul 2010

ALSI new high speed 300 mm low k grooving and dicing systems to American and Asian customers.

After an intensive development effort and close cooperation with a number of strategic customers, ALSI is shipping the first systems of their new ICA 1204 platform. The platform is for up to 300 mm wafers with full integration of various pre-and post laser processes. The platform is equipped on the unique planar motor system which has proven its superior performance and is based on ALSI’s multibeam laser concept for fast and high quality dicing and grooving process.more


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