
ALSI offers laser dicing systems that, depending on process time and required flexibility, are ideally suited for your application and enable the lowest cost of ownership:
State of the art and dedicated semi conductor equipment manufacturers
Factory quality standards comply with ISO 9001: 2000 and 14001 standards. The factory has many years of experience in building semiconductor equipment and can comply with any other high level of custom standards if needed.
The supply chain of our system is organized to safeguard the Customer Satisfaction as best as possible. The system is built according to released technical documentation and customized in line with process and application development results. An extensive factory acceptance test (FAT) is organized based on documented procedures and checklists, followed by a site acceptance test (SAT). Shipment is directly from the factory to the customer.
Our manufacturing is located in the eastern part of the Netherlands, approx 1 hour drive from our development and support location.
Come and visit us @ booth # 826 and discuss our new developments on
Low-K, IC, Thin Wafer and LEDmore
After an intensive development effort and close cooperation with a number
of strategic customers, ALSI is shipping the first systems of their new
ICA 1204 platform. The platform is for up to 300 mm wafers with full integration
of various pre-and post laser processes. The platform is equipped on the
unique planar motor system which has proven its superior performance and
is based on ALSI’s multibeam laser concept for fast and high quality dicing
and grooving process.more