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A strong wafer dicing operation is vital to the manufacturing process. At the wafer stage the wafer has the highest value.


As manufacturing trends continue to drive material cost optimizations, the need to increase the number of dies per wafer remains a primary focus. 		 
Dicing semiconductor wafers with the ALSI Laser Separation System in stead of mechanical sawing offers a number of Cost-of-Ownership (CoO) benefits:
  • Productivity Increase
  • Yield improvements
  • Cost savings
  • Uptime improvement
  • Due to strongly reduced cutting grooves (“sawing” lanes) the number of dies per wafer can be increased resulting in a productivity increase of the waferfab, the front-end of semiconductor industry,
  • Faster process speed results in an increased throughput time (productivity increase of the backend),
  • Due to contact-less dicing the yield for some sensitive semiconductor wafers is increased; GaAs, thin wafers for chip-cards, etc. show no chipouts or cracks.
  • Higher uptime because of less maintenance.
check out your dicing costs savings examples:

LED's

 Transistor or Diodes RF IC's
250 x 250 µm pitch 500 x 500 µm pitch 500 x 500 µm pitch
ø2" GaAs wafer ø6" Si wafer ø6" GaAs wafer
200 µm Thickness 200 µm Thickness 200 µm Thickness
Compared to sawing process.
 Compared to sawing process.
 Compared to scribe and break process.
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