For many of these new applications ALSI´s laser technology offers the ideal solution. Additionally ALSI´s multiple laser beam process results in fast throughput times and small dicingstreet width (< 30 micron), which considerably reduces the Cost of Ownership for semiconductor manufacturers.

ALSI´s proprietary multiple beam technology is the only mature laser dicing process that has been proven in high volume production for many years; since more than ten years two major semiconductor companies have been using this laser singulation for dicing small signal transistors and diodes at an annual volume in excess of 10 bill. pcs.