Advanced Laser Seperation International, ALSI, is the next Philips spin-off that is changing the rules of the semiconductor equipment market by strategically applying innovative technologies to bolster its growing position in the wafer dicing market. Latest developments in the field of mechatronics, extreme short pulse lasers, and opto-electronics are core areas of ALSI’s innovation: submicron magnetically driven wafer-stages, automatic wafer-handling, machine control, Diffractive Optics, Multiple Beam Laser Cutting, etc.

ALSI’s technologies have lead to breakthrough in the LED and RF-IC industry; wafers of High Brightness LED’s and GaAs RF-IC’s for mobile communication are increasingly diced by ALSI’s Multiple Laser Beam Process.
The next step in ALSI’s market strategy is the dicing of Silicon IC wafers for memories, mobile communication, and micro processors. In these segments the growing need for laser-dicing is driven by the use of low-k material and the trend to extreme thin wafers for stacked die IC’s and RF-ID’s.
ALSI technology challenges for these new segments are the development of a twelve inch wafer-stage, automatic handling of twelve inch wafers, adaptive machine control platform, and laser processes down to the pico-second range.

To keep up with the success and follow our growth we need to strengthen and expand our capabilities in various disciplines and are looking for:

A Process development engineer

For new market applications new laser dicing processes need to be developed and benchmarked on its value propositions. Also we strive for continuous improvements on our overall laser dicing process capability. The Senior Process /Laser Scientist has an important contribution to new ideas and concepts and is responsible for planning, conducting and evaluating experiments. He/she communicates with development partners and/or selected customers the activities and progress.  The Senior Process Engineer/ Laser Scientist is functionally reporting to ALSI’ Process Development & Application Manager and is working in a team with specialist in different fields.

• Define and execute new development programs for laser separation of semiconductor and micro-electronic substratesIncrease understanding of ALSI’ semiconductor laser dicing process through
  • Process analysis
  • Benchmarking alternative techniques
  • Formulation of hypotheses
  • Defining experiments for verification/falsification of hypotheses
• Identify and overcome challenges in existing processes
• Analyze experimental results and formulate technical and scientific  reports to a high standard
• Expansion of the application fields for full cut laser dicing techniques
• Coaching of Process Engineers

• Academic degree in Physics or (Solid State) Material Science 
• Analytical thinking and systematic approach to problem solving
• Experience with laser material processing and/or with laser optics is an advantage
• Experience in the front- and backend processing in the semiconductor industry would be an advantage.

• A challenging high tech environment with innovative and break through technologies.
• A know how & technology driven organization in a strong growth phase with worldwide orientation.
• An attractive remuneration package.

Your reaction: ALSI BV Human Resource Management, Platinawerf 20 G , 6641 TL Beuningen, the Netherlands Telephone: 31-24- 678 2888 E-mail: info@laserdicing.com