Advanced Laser Seperation International, ALSI, is the next Philips spin-off that is changing the rules of the semiconductor equipment market by strategically applying innovative technologies to bolster its growing position in the wafer dicing market. Latest developments in the field of mechatronics, extreme short pulse lasers, and opto-electronics are core areas of ALSI’s innovation: submicron magnetically driven wafer-stages, automatic wafer-handling, machine control, Diffractive Optics, Multiple Beam Laser Cutting, etc. |