Archive
ALSI at Semicon West 2010
22-06-2010
ALSI is attending the Semicon West on 13 - 15 July 2010, at the Moscone Center, in San Francisco, California. Please visit us at our booth no. 5376
Multi beam laser dicing, the new standard for laser grooving and dicing of low k wafers!
21-04-2010ALSI has again set the standard with their patented multi-beam laser dicing technology for a new application. After successful introductions and market leader position for transistor/diodes, LED’s and RFIC, ALSI has released this time successfully the multi-beam technology for grooving and dicing of low-k wafers.
China Semiconductor Technology International Conference 2010
17-02-2010
Presentation ALSI @ Symposium VII: Packaging and Assembly
NEW BREAKTHROUGH: Laser Dicing Technology for Thin Silicon Wafers
03-08-2009ALSI has developed a full cut laser dicing technology and process for thin wafers mounted on Die Attach Film.
SEMI China
17-03-2009Enabling Technology in Thin Wafer Dicing
Jeroen van Borkulo, Rogier Evertsen, Rene Hendriks,
ALSI, platinawerf 20G, 6641TL Beuningen Netherlands
Abstract
Driven by IC packaging and performance requirements, the die separation process is facing three main trends: Thinner wafers, stronger die and non-Silicon materials. Memory capacity increase, multichip functions and continuous package miniaturization require ultra thin wafer dicing. For IC performance increases, low-K material and other materials (top layers and even substrates) require different dicing methods for efficient and delamination free dicing processes. It is demonstrated that conventional blade dicing has reached the end of its capabilities and does not meet the separation requirements. Particular thin wafer development and the use of Die Attach Film (DAF) have added challenges and restrictions to the dicing technologies. Laser dicing processes have developed and have become the preferred dicing technology. This paper will discuss the various laser dicing technologies introduced for the different segments and will address the specific performances. Using a multibeam laser dicing process add significant advantages to the different solutions.
Full article: paper submitted to SEMI China
Mechatronica Magazine
06-03-2009Mechatronica Magazine zich op machinebouwindustrie, gericht op beslissers en hoogopgeleiden in de systeembouw en high-end machinebouw met de nadruk op interdisciplinaire ontwikkeling
Artikel: Van concept naar serie met Ethercat.
www.mechatronicamagazine.nl
05-11-2008www.mechatronicamagazine.nl is een geavanceerde website die bezoekers bedient met het laatste nieuws op hun vakgebied. Artikel: In 2009 gaat Alsi 300 mm-lasersnijmachines leveren.
LINK Magazine
01-10-2007Link is een managementblad over eigentijdse vormen van samenwerking tussen bedrijven onderling en tussen bedrijven, (semi-)overheid, universiteiten en hogescholen. De kernwoorden zijn management, marketing en technologie. Artikel: Laserseperatie breekt door.
Compound Semiconductor
01-07-2007Compound Semiconductor provides in-depth, timely information on current developments within the compound semiconductor industry. Coverage includes manufacturing and research, devices and materials, markets and applications, and all aspects of compound semiconductor technology. Article: Lasers make the grade at GaAs fabs (pdf) or Lasers make the grade at GaAs fabs.
FEM
17-03-2007FEM is een onmisbare bron van informatie voor de zakelijke professional die het beste uit zichzelf en zijn onderneming wil halen. Artikel: ALSI over 2 jaar klaar voor beurs (pdf). of direct: ALSI over 2 jaar klaar voor de beurs.
Semiconductor Manufacturing
01-08-2006Semiconductor Manufacturing is a USA magazine covering Computer Engineering. Article: Dicing gets difficult.
Gelderlander
22-09-2005Het dagblad de Gelderlander is een regionale krant die verschijnt in het grootste gedeelte van Gelderland, gebieden in Noord-Brabant en Limburg die op Nijmegen zijn gericht (Maasland) en delen van de provincie Utrecht zoals Veenendaal en Rhenen. Artikel: Laser vervangt zaag bij snijden van chips.
News
24 Aug 2010
ALSI @ Semicon in Taiwan on 8-10 Sept 2010
05 Aug 2010
Succesful introduction of new ICA 1204 at Semicon West
31 Jul 2010
ALSI new high speed 300 mm low k grooving and dicing systems to American and Asian customers.
