
From Beuningen, the Netherlands, ALSI controls the design, development and manufacturing of advanced laser dicing systems as well the marketing and servicing of these systems worldwide. The multi beam laser process and applications are developed in our laboratory in Beuningen the Netherlands. ALSI’s customers are the major and well known semiconductor manufacturers whereby the rapidly growing installed base demonstrates the success of ALSI’s laser dicing concept.
Recently ALSI has introduced a breakthrough in a dicing process and equipment platform for dicing of Silicon IC wafers for memories, mobile communication, and micro processors. In these segments the growing need for laser dicing is driven by the use of low-k material and the trend to extremely thin wafers for stacked die IC’s or RF-ID’s.
Come and visit us @ booth # 826 and discuss our new developments on
Low-K, IC, Thin Wafer and LEDmore
After an intensive development effort and close cooperation with a number
of strategic customers, ALSI is shipping the first systems of their new
ICA 1204 platform. The platform is for up to 300 mm wafers with full integration
of various pre-and post laser processes. The platform is equipped on the
unique planar motor system which has proven its superior performance and
is based on ALSI’s multibeam laser concept for fast and high quality dicing
and grooving process.more