A.L.S.I.  Company

Company

ALSI is the leading supplier of advanced laser dicing solutions

ALSI is the world's leading provider of laser dicing systems for the semiconductor manufacturing industry. These systems are essential for the production of integrated circuits or microchips meeting the electronic consumers demands such as:

  • increased functionality
  • reduced size
  • cost reduction

From Beuningen, the Netherlands, ALSI controls the design, development and manufacturing of advanced laser dicing systems as well the marketing and servicing of these systems worldwide. The multi beam laser process and applications are developed in our laboratory in Beuningen the Netherlands. ALSI’s customers are the major and well known semiconductor manufacturers whereby the rapidly growing installed base demonstrates the success of ALSI’s laser dicing concept.

Recently ALSI has introduced a breakthrough in a dicing process and equipment platform for dicing of Silicon IC wafers for memories, mobile communication, and micro processors. In these segments the growing need for laser dicing is driven by the use of low-k material and the trend to extremely thin wafers for stacked die IC’s or RF-ID’s.

News

24 Aug 2010

ALSI @ Semicon in Taiwan on 8-10 Sept 2010

Come and visit us @ booth # 826 and discuss our new developments on Low-K, IC, Thin Wafer and LEDmore


05 Aug 2010

Succesful introduction of new ICA 1204 at Semicon West

more


31 Jul 2010

ALSI new high speed 300 mm low k grooving and dicing systems to American and Asian customers.

After an intensive development effort and close cooperation with a number of strategic customers, ALSI is shipping the first systems of their new ICA 1204 platform. The platform is for up to 300 mm wafers with full integration of various pre-and post laser processes. The platform is equipped on the unique planar motor system which has proven its superior performance and is based on ALSI’s multibeam laser concept for fast and high quality dicing and grooving process.more


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