Application

Dedicated to your products

ALSI’s target is clear: Develop laser dicing solutions that

• Enable new semiconductor product developments

• Reduce the product manufacturing cost.

To achieve:

• Zero defects

• Increase wafer yield (narrow dicing street)

• High throughput.

  
  

Our Multibeam laser process has proven this in multiple application fields.

Every application has its specific requirements and characteristics. Our team of dedicated process development and application engineers with wide experience in semiconductors, laser physics, chemistry, and other fields are developing the widest process windows for your specific application achieving small dicing kerf, stress-free cutting, elimination of any chip-out and all at the smallest possible heat affected zone. Our engineers have the ability to work in our applications lab that is well equipped with various systems with different laser sources

Please check out the benefits for your specific application in the sub topics.