Advanced Laser Separation International (ALSI) N.V.
The inventor of laser dicing
World's leading provider of laser dicing systems
Advanced Laser Separation International (ALSI) N.V., is the inventor
of laser dicing and the world's leading provider of laser dicing systems
for the semiconductor industry. The process is based on a unique multi
beam laser dicing technology.
The multi laser beam dicing process is the technology with very low
thermal impact while having a very high productivity. ALSI’s solutions
enable you to reduce your manufacturing cost significantly and to execute
your semiconductor technology road map.
Main Office
Advanced Laser Separation International (ALSI)
N.V. Platinawerf 20-G
6641 TL Beuningen (Gld)
The Netherlands
A Top 5 worldwide semiconductor vendor has qualified ALSI’s multi-beam
laser dicing system.
Major
Taiwanese OSATS purchases multiple ALSI’s Low-K Grooving Systems.