The inventor of multi-beam laser dicing and grooving
The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ALSI’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.
Syntens Dutch Innovation, Mercedes Benz and NRC newspaper announced on June 12, 2013 ALSI's number 5 rating out of 100 innovation companies!!
Perseverance and Innovation strengths of ALSI resulted in this excellent achievement.
Setting Up of Advanced Laser Technology Centremore
March 18 - 20, 2014more
Continuation of business of ALSI by ASM Laser Separation International (ALSI) B.V.more
ALSI will be represented by Cretek Inc, booth 1352more
AIMP Industrial Marketing Congres "Marketing in a disruptive world"more
Advanced Laser Separation International (ALSI) NV has received the order for a laser dicing system from Plessey Semiconductors Ltd for their UK based LED manufacturing facility.more