Advanced Laser Separation International N.V. (ALSI), is the inventor
of laser dicing and the world's leading provider of laser dicing systems
for the semiconductor industry. The process is based on a unique multi
beam laser dicing technology.
The multi laser beam dicing process is the technology with very low
thermal impact while having a very high productivity. ALSI’s solutions
enable you to reduce your manufacturing cost significantly and to execute
your semiconductor technology road map.
Japan
Appex Corporation
Ichikawa Factory
717-30, Futamata,
Ichikawa, Chiba, 272-0001, Japan
Phone: +81 (47) 3284720 matsumoto@appex.co.jp
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South Korea SMSemitech
SungMoon Semitech Corp.
C-221, SigmaII Bldg., 18 Gumi-dong
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-741 Korea
Contact: Mr. Dae-Hee Lee
Phone: +82-31-707-5980 dhlee@smsemitech.com www.smsemitech.com
Press
release about the development
of our new
laser dicing machine for the
semi-conductor marketmore
31 Jul 2010
ALSI high speed 300 mm low k grooving and dicing systems to American and Asian customers.
After an intensive development effort and close cooperation with a number
of strategic customers, ALSI is shipping the first systems of their new
ICA 1204 platform. The platform is for up to 300 mm wafers with full integration
of various pre-and post laser processes. The platform is equipped with
the unique planar motor system which has proven its superior performance
and is also based on ALSI’s multibeam laser concept for fast and high quality
dicing and grooving processes.more
